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ZEISS Crossbeam - FIB-SEM for High Throughput 3D Analysis and Sample Preparation​
Semiconductor Failure Analysis

ZEISS FE-SEM

Enhanced Resolution for Semiconductor Package Analysis

The transition towards packages with three-dimensional architecture continues to grow across industry. The resulting decrease in interconnect size and increased material complexity has led to significant challenges when it comes to the development and analysis of processes.

The ZEISS FE-SEM family supports failure analysis techniques that address the complexity of next-generation devices, and provides enhanced resolution features.

 

  • Our Gemini technology produces best in class resolution for a wide range of materials
  • Enhanced detectors provide exceptional signal-to-noise and resolution for low kV applications and material contrast
  • Available with large chamber and optimized port geometries for compositional and phase analysis with EDS and EBSD
  • ZEN software modules to increase productivity with automated imaging and routine analysis
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Failure Analysis Case Study

Watch Video to Learn How the MCS Group Leverage Our ZEISS FE-SEM for Failure Forensics

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High Pixel Resolution Imaging

For Distortion Free Large Field of View

High pixel resolution of up to 32K x 24K makes it possible to image fine details while maintaining the overview and context of your region of interest.

Our Gemini optics produce superb low voltage imaging without immersion optics or stage bias. This is crucial for imaging non-conductive and beam-sensitive soft polymer materials in advanced packaging.

Download the correlative microscopy workflow

Enhanced Detectors for

Unmatched Material and Phase Contrast

The versatility of our Gemini column with its enchanced detectors is suited to examining Through-Silicon Vias (TSV), Cu-Cu bonds, solder materials, Intermetallic Compound (IMC) layers, or wire bonds. It delivers unparalleled imaging performance.

First-class material phase and channelling contrast, provide insights for failure analysis and facilitates routine process characterisation.

 

Download failure analysis case study to learn more

Beam Sleeve and VP Mode for High-resolution Imaging

Precise EDS Analysis on Soft and Nonconductive Samples

ZEISS FE-SEM incorporates a beam sleeve and Variable Pressure (VP) imaging mode to amplify resolution and enables analysis of non-conductive and soft materials without extensive sample preparation.

The beam sleeve minimises the beam path through the low vacuum region, improving signal to noise for high resolution imaging and Energy-Dispersive X-ray Spectroscopy (EDS) analysis further reducing charging effects, and beam-induced damage.

Download case study to learn how this impacts the correlative microscopy workflow

Montage Imaging and Correlative Workflow

For Automated ROI Acquisition

The ZEISS FE-SEM is well suited to large area imaging workflows thanks to features like our recipe-based automated image acquisition, a streamlined and automated imaging process across multiple regions of interest (ROI) and samples.

This powerful attribute eliminates the need for manual intervention and increases efficiency. Additionally, the ZEISS correlative workflow allows for the seamless combination of data acquired from multiple modalities and different tools such as light microscopy, X-ray and others, guiding acquisition of specific regions of interest. This leads to more accurate analysis and insightful results and a comprehensive understanding of samples.

Download case study to learn more about the correlative microscopy workflow

Large chamber with ports, optimized geometry for EDS

and immersion-free optics for EBSD

The large chamber is optimized with multiple ports for 180 deg EDS acquisition and EBSD analysis. The fast switch between low current and high current modes in the Gemini column and the immersion-free optics eliminates artefacts and makes it easy to use for analytical work.

Download the Correlative Workflow for Nanoscale Failure Analysis Case Study

For Advanced Electronics Packages

Discover a groundbreaking correlative workflow that revolutionizes semiconductor defect analysis! Delve into cutting-edge 3D X-ray microscopy (XRM) techniques for non-destructive imaging and precise navigation of nanoscale structures.

Unveil the true potential of advanced package architectures by eliminating the risk of missing or destroying fault regions in physical failure analysis (PFA) workflows. Enhance your expertise with a proprietary micromachining process that prepares deformation-free surfaces for high-resolution scanning electron microscopy (SEM) analysis.

Stay ahead of the curve and optimise your semiconductor manufacturing processes with this transformative, must-read research!

Take a sneak peek at the case study contents in the image on the left. 

Complete form below to download your pdf copy!

Interested in Cutting-edge Correlative Workflows?

Complete the form below to download your copy of our nanoscale failure analysis case study.

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