From Virtual to Reality:

When something goes wrong with an electronics-based system, as engineers, the first thing we do is test the system to find the faulty part. But what comes next? We may be able to simply replace that part but how do we know whether the failure was a one-off or a wider problem that may require intervention?

To answer this question, we must identify the root-cause of the problem. Was it caused by a manufacturing defect (latent defect potentially widespread across a certain batch or date code range), or because the part was driven outside its operating limits or environment? Physical failure analysis can provide the diagnostic information that allows us to assess risk and make appropriate technical and commercial decisions. However, with the complexity of today’s semiconductor devices and packaging technology, identifying and targeting regions of interest can be challenging.

This webinar recording covers a correlative workflow for effective physical failure analysis, based on materials science. We explain how to interrogate a component within its package and identify specific features of interest using ZEISS 3D X-Ray microscopy equipment. MCS Perfect Edge™ is then used to target these features for forensic analysis using ZEISS GeminiSEM 450. Mr. Stewart McCracken does a deep-dive on a case study, showing the kind of evidence contained in material microstructure and how this can be used to diagnose the root-cause of failure, leading to an effective solution.